Taiwan Semiconductor Manufacturing, part # ES2FAHR3 has these features: – Glass passivated junction chip – Ideal for automated placement – Low profile package – Built-in strain rellef – Super fast recovery time for high efficiency – Moisture sensitivity level: level 1, per J-STD-020 – Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC – Halogen-free according to IEC 61249-2-21 definition

Mechanical Data

Case: DO-214AC (SMA) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix “G” on packing code – Green compound (halogen-free) Base P/N with prefix “H” on packing code – AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix “H” on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.06 g (approximately)

TSM:ES2FAHR3

ES2FAHR3